Gases common to the semiconductor industry like silane, TEOS, siloxane, and HMDS, can form solids when combusted. In applications where these gases need abatement, the design of the EDGE™ SB prevents clogging and buildup of solids that would inhibit operation.
A key factor in the design of these oxidizers is the flame temperature of the reactants. At higher flame temperatures, silica formations can become much more difficult to remove. Lower flame temperatures allow for lighter, finer silica depositions, easing cleaning and reducing system downtime.
Another factor is the burner itself. A Pyromat™ burner is particularly advantageous in this application because it provides a fully purged, uniform burner surface which repels solid deposition. Additionally, the durable surface can be cleaned to remove any errant solids that may stick to it.



