Technology

Gases common to the semiconductor industry like silane, TEOS, siloxane, and HMDS, can form solids when combusted. In applications where these gases need abatement, the design of the EDGE™ SB prevents clogging and buildup of solids that would inhibit operation.

A key factor in the design of these oxidizers is the flame temperature of the reactants. At higher flame temperatures, silica formations can become much more difficult to remove. Lower flame temperatures allow for lighter, finer silica depositions, easing cleaning and reducing system downtime.

Another factor is the burner itself. A Pyromat™ burner is particularly advantageous in this application because it provides a fully purged, uniform burner surface which repels solid deposition. Additionally, the durable surface can be cleaned to remove any errant solids that may stick to it.

Solutions We Offer

ALZETA’s EDGE SB recuperated thermal oxidizer combines our unique short flame-length premixed surface combustion burner in a more conventional thermal oxidizer design. Benefits include compact size, high DRE, and very low maintenance. Operating temperatures are between 1300°F and 1500°F.

The short flame-length associated with the SB/CSB burner technology eliminates zones of high combustion temperatures, creating an environment that prevents particle agglomeration when processing SiO2 forming VOCs such as HMDS. Particles remain as a dry dust rather than forming glass-like coatings along interior surfaces, easing cleaning and reducing downtime. Originally designed for the California semiconductor market, the EDGE SB ensures low NOx emissions.